Description
- Silicon Thin Film Chip Resistor -Gold plated bond pads- Wire bondable MIL-S-883 visually inspected and packaged 5 pcs. in waffle pack
- Die size is 20 mil x 20 mil. Die thickness is 10 mil. Backside is gold metalized.
- Used in DC and RF microwave hybrid circuits for biasing and feedback Additional specifications available upon request at usmicrowaves.com
- U.S. Microwaves products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent of U.S. Microwaves.
Full description not available
